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Etchgard™ HP and HPX Cartridge Filters

Etchgard™ HP and HPX Cartridge Filters
 
Filtration of copper deposition solution with high flow rate performance and reliable contaminant retention capabilities in 10 -180 nm technology nodes.
 
Etchgard™ HP and HPX Cartridge Filters
● Industry: Semiconductor, LED 
● Process: Wet Clean and Clean, Deposition
● Chemistry: Dilute Acids, Dilute Bases, Deposition
● Installation Point:  Point of Tool

Product Documentation  


Product Specifications

    TORRENTO ATE/AT3 TORRENTO 1500/3000
Materials: Membrane: Prewet, nondewetting PTFE  
  Supports PFA  
  Catridge o-ring options E-FKM, Chemraz® or Kalrez®, Viton®
Extreme™ ETP
-
  Shell PFA  
Retention rating:   10 nm 15 nm
    20 nm  
Membrane area: 10" ATE 10" 2 m² (21 ft²) 1500 type 0.19 m² (2.05 ft²)
    ATE 20" 4 m² (42 ft²) 3000 type 0.44 m² (4.74 ft²)
    ATF 10" 3 m² (32 ft²)  
    ATF 20" 6 m² (64 ft²)  
Maximum operating conditions: Maximum operating pressure: 0.58 MPa (5.8 bar; 84 psi) @ 25°C (77°F) 0.44 MPa (4.4 bar, 64 psi) @ 25°C (77°F)
    0.097 MPa (0.97 bar; 14 psi) @ 200°C (392°F) 0.19 MPa (1.9 bar, 28 psi) @ 95°C (203°F)
  Maximum forward differential pressure 0.44 MPa (4.4 bar; 64 psi) @ 25°C (77°F) 0.39 MPa (3.9 bar; 57 psi) @ 25°C (77°F)
    0.05 MPa (0.52 bar, 7.5 psi) @ 180°C (356°F) 0.19 MPa (1.9 bar; 28 psi) @ 95°C (203°F)
  Maximum reverse differentialpressure 0.34 MPa (3.45 bar, 50 psi) @ 25°C (77°F) 0.29 MPa (2.9 bar; 42 psi) @ 25°C (77°F)
  Maximum operating temperature: 180°C (356°F) 95°C (203°F)
Metallic extractables: Standard Testing conducted for 12 metals  
  Standard Testing conducted for 16 metals  
Particle sheddings cleanliness:   <15 particles/10 mL  0.2 µm @
5 L/min Dl water flow
<10 particles/10 mL  0.2 µm @ 5
L/min Dl water flow
"Per 10" cartridge equivalent