FlowPlane™ Linear Filtration Technology
Best-in-class linear filtration technology enabling greatly increased flow rate and superior contaminant retention capabilities in sub 45 nm technology nodes.
FlowPlane™ Linear Filtration Technology Applications
● Industry: Semiconductor
● Process: Wet Etch and Clean
● Chemistry: Aggressive Acids, Aggressive Bases and Solvents
● Installation Point: Point-of-Tool
Product Documentation
Product Specifications
All FlowPlane product configurations are PFOA free.
Best-in-class linear filtration technology enabling greatly increased flow rate and superior contaminant retention capabilities in sub 45 nm technology nodes.
FlowPlane™ Linear Filtration Technology Applications
● Industry: Semiconductor
● Process: Wet Etch and Clean
● Chemistry: Aggressive Acids, Aggressive Bases and Solvents
● Installation Point: Point-of-Tool
Product Documentation
Product Specifications
| Materials: | Membrane | Prewet, nondewetting PTFE |
| Supports, shell | PFA | |
| Retention rating: | 7 nm | |
| Surface area: | 0.60 m² (6.46 ft²) | |
| Maximum Operating Conditions: | Maximum operating pressure | 0.59 MPa (5.9 bar; 86 psi) @ 25°C (77°F) |
| 0.19 MPa (1.9 bar, 28 psi) @ 150ºC (302°F) | ||
| Maximum forward differential pressure | 0.39 MPa (3.9 bar; 57 psi) @ 25°C (77°F) | |
| Maximum reverse pressure | 0.29 MPa (2.9 bar; 42 psi) @ 25°C (77°F) | |
| Maximum operating temperature | 150°C (302°F) | |
| Metallic extractables | UCM-10 | Testing conduted for 23 metals |
| Other extractables | UCM-10 | TOC, CI, NVR, F |
